自動車ソフトウェア三規格参考文献
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388
3rd Generation Partnership Project; Technical Specification Group Services and System Aspects; Enhancement of 3GPP support for V2X scenarios; Stage 1(Release 16) 3GPP TS 22.186 V16.2.0 (2019-06).
https://www.etsi.org/deliver/etsi_ts/122100_122199/122186/16.02.00_60/ts_122186v160200p.pdf
Reference
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- SAE International, "AUTOMA TED DRIVING LEVELS OF DRIVING AUTOMA TION ARE DEFINED IN NEW SAE INTERNATIONAL STANDARD J3016", December 2016; US Homeland Security Digital Library, "Self-Driving Cars: Levels of Automation", March 2017 https://www.hsdl.org/?view&did=801463.
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- IEEE Std 1609.0-2013: "IEEE Guide for Wireless Access in V ehicular Environments (W A VE) architecture".
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Abbreviated injury scale; Association of the advancement of Automotive medicine; Barrington, IL, USA
https://www.aaam.org/abbreviated-injury-scale-ais-position-statement/
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Abdulkhaleq A. et al., A Systematic Approach Based on STPA for Developing a Dependable Architecture for Fully Automated Driving Vehicles, 4th European STAMP Workshop 2016, Procedia Engineering, 179, 41-51, 2017
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163
AEC Q100, Failure Mechanism Based Stress Test Qualification For Integrated Circuits http://www.aecouncil.com/Documents/AEC_Q100_Rev_J_Base_Document.pdf
1.2 Reference Documents
Current revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subs quent qualification plans will automatically use updated revisions of these
referenced documents.
1.2.1 Automotive
AEC-Q001 Guidelines for Part Average Testing
AEC-Q002 Guidelines for Statistical Yield Analysis
AEC-Q003 Guidelines for Characterizing the Electrical Performance
AEC-Q004 Zero Defects Framework
AEC-Q005 Pb-Free Requirements
AEC-Q006 Qualification Requirements for Components Using Copper (Cu) Wire Interconnections
SAE J1752/3 Integrated Circuits Radiated Emissions Measurement Procedure
SAE J1879/J1211/ZVEI Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications
IATF 16949 Automotive Quality Management System Standard
AIAG Production Part Approval Process (PPAP)
AEC-Q100-001 Wire Bond Shear Test
AEC-Q100-002 Human Body Model (HBM) Electrostatic Discharge Test
AEC - Q100 - REV-J
AEC-Q100-004 IC Latch-Up Test
AEC-Q100-005 Non-Volatile Memory Program/Erase Endurance Data Retention and Operational Life Test
AEC-Q100-007 Fault Simulation and Test Grading
AEC-Q100-008 Early Life Failure Rate (ELFR)
AEC-Q100-009 Electrical Distribution Assessment
AEC-Q100-010 Solder Ball Shear Test
AEC-Q100-011 Charged Device Model (CDM) Electrostatic Discharge Test
AEC-Q100-012 Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
1.2.2 Military
MIL-STD-883 Department Of Defense Test Method Standard: Microcircuits
1.2.3 Industrial
JEDEC JESD22 Reliability Test Methods for Packaged Devices
UL-STD-94 Tests for Flammability of Plastic materials for parts in Devices and Appliances
IPC/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
JESD89 Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor Devices
JESD89-1 System Soft Error Rate (SSER) Test Method
JESD89-2 Test Method For Alpha Source Accelerated Soft Error Rate
JESD89-3 Test Method for Beam Accelerated Soft Error Rate
JESD94 Application Specific Qualification Using Knowledge Based Test Methodology
JESD671 Component Quality Problem Analysis and Corrective Action Requirements
JEP155 Recommended ESD Target Levels for HBM Qualification
JEP157 Recommended ESD-CDM Target Levels
JEP178 Electrostatic Discharge (ESD) Sensitivity Testing ? Reporting ESD Withstand Levels on Datasheets
164
AEC Q101, Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors http://www.aecouncil.com/Documents/AEC_Q101_Rev_E_Base_Document.pdf
1.2 Reference Documents
Current revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subs quent qualification plans will automatically use updated revisions of these referenced documents.
1.2.1 Military
MIL-STD-750 Test Methods for Semiconductor Devices
1.2.2 Industrial
UL-STD-94 Test for Flammability of Plastic Materials of Parts in Devices and Appliances.
JEDEC JESD-22 Reliability Test Methods for Packaged Devices
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
JEDEC/IPC J-STD-035 Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
1.2.3 Automotive
AEC-Q001 Guidelines for Part Average Testing
AEC-Q005 Pb-Free Test Requirements
AEC-Q006 Qualification Requirements for Components Using Copper (Cu) Wire Interconnections
AEC-Q101-001 Human Body Model (HBM) Electrostatic Discharge (ESD) Test
AEC-Q101-003 Wire Bond Shear Test
AEC-Q101-004 Miscellaneous Test Methods? Unclamped Inductive Switching? Dielectric Integrity? Destructive Physical Analysis
AEC-Q101-005 Charged Device Model (CDM) Electrostatic Discharge (ESD) Test
AEC-Q101-006 Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
1.2.4 Other
IATF 16949
1.2.5 Decommissioned
AEC-Q101-002 Machine Model (MM) Electrostatic Discharge (ESD) Test? Removed from JEDEC due to obsolescence. HBM and CDM cover virtually all known ESD-related failure mechanisms.
165
AEC Q200, Stress Test Qualification For Passive Components http://www.aecouncil.com/Documents/AEC_Q200_Rev_E_Base_Document.pdf
1.3 Reference Documents
The current revision of the referenced documents (shown below) will be in effect at the date of agreement to the qualifcation plan. Subsequent qualification plans will automatically use the latestrevisions of these referenced documents.
AEC-Q005 Pb-Free Test Requirements
AEC-Q200-001 Flame Retardance Test
AEC-Q200-002 Human Body Model (HBM) Electrostatic Discharge (ESD) Test
AEC-Q200-004 Measurement Procedures for Resettable Fuses
AEC-Q200-005 Board Flex Test
AEC-Q200-006 Terminal Strength (SMD) / Shear Stress Test
AEC-Q200-007 Voltage Surge Test
EIA-469 Standard Test Method for Destructive Physical Analysis (DPA) for Ceramic Monolithic Capacitors
IATF Quality Management System for Organizations in the Automotive Industry
IEC 60695-11-5 Fire Hazard Testing ? Part 11-5: Test Flames ? Needle Flame Test Method, Apparatus, Confirmatory Test Arrangement and Guidance
IEC 60127 Series Miniature Fuses
IEC 60068-2-21 Robustness of terminations and integral mounting devices
ISO-7637-1 Road Vehicles ? Electrical Disturbances from Conduction and Coupling ? Part 1: Definitions and General Considerations
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
JESD22-A104 Temperature Cycling
JESD22-B100 Physical Dimension
JESD22-B106 Resistance to Solder Shock for Through-Hole Mounted Devices
JIS-C-5101-1 Fixed Capacitors for use in Electronic Equipment ? Part 1: Generic Specification
MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts
MIL-STD-883 Test Method Standard Microcircuits
UL 94 Tests for Flammability of Plastic Materials for Parts in Devices and Appliance
254
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ASAM OpenCRG http://www.asam.net/standards/detail/opencrg/
3.4. References to other standards
ISO 8855 for right handed coordinate systems
ISO 8601 for time / date
ISO 8859-1 for plain-text encoding
Georeferencing (ISO DIN 19111)
ASAM OpenDRIVE
ASAM OpenSCENARIO
IEEE 754
369
ASAM OpenDRIVE http://www.asam.net/standards/detail/opendrive/
3.3. References to other standards
XML 1.0 Schema [4]
UML 2.5.1 Standard [10]
ISO 3166-2 for country codes [8]
ISO 8855 for right handed coordinate systems
ISO 8601 for time / date [7]
Georeferencing (ISO DIN 19111)
ASAM OpenCRG [3]
371
ASAM OpenSCENARIO http://www.asam.net/standards/detail/openscenario/
Normative Reference
ASAM OpenDRIVE [1]
ASAM OpenCRG [2]
ISO 8855 [11]
ISO 8601 [4]
W3C XML Schema Definition Language [3]
Bibliography
[1] ISO 22901-1: Road vehicles - Open diagnostic data exchange (ODX). International Organisation for Standardisation, 2008.
[2] Sparx Systems, Enterprise Architects. 2019.
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Automotive ISAC, Automotive Cybersecurity Best Practice. https://www.automotiveisac.com/best-practices/
References
ISO 17799: Mobile Phone Security https://www.iso.org/standard/39612.html ISO/IEC 17799:2005
Information technology ? Security techniques ? Code of practice for information security management[Withdrown]
ISO/IEC 27001?Information Security Management
ISO/IEC 27010:2012?Inter-sector and Inter-organizational Communications
ISO/IEC 27035:2011 Information Security Incident Management
ISO/IEC 30111: Vulnerability Handling Procedures
NHTSA: Cybersecurity Best Practices for Modern Vehicles
NIST 800-30: Guide for Conducting Risk Assessments
NIST SP 800-50: Building an Information Technology Security Awareness and Training Program
NIST SP 800-61: Computer Security Incident Handling Guide
NIST 800-64: Security Considerations in the Systems Development Lifecycle
NIST SP 800-121 Guide to Bluetooth Security
NIST SP-127: Guide to Securing WiMAX Wireless Communications
NIST 800-137: Continuous Monitoring for Federal Information Systems and Organizations
NIST SP 800-150: Guide to Cyber Threat Information Sharing
SAE J3061: Cybersecurity Guidebook for Cyber-Physical Vehicle Systems
Resources
Industry Associations, such as Auto Alliance and Global Automakers
International Organization for Standardization (ISO)
National Institute of Standards and Technology (NIST)
SAE International
41
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53
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＜この記事は個人の過去の経験に基づく個人の感想です。現在所属する組織、業務とは関係がありません。＞
参考資料
自動車ソフトウェア三規格参考文献
https://qiita.com/kaizen_nagoya/items/def6176e74e8cd13ca79
自動車ソフトウェア三規格参考文献の参考文献
https://qiita.com/kaizen_nagoya/items/4595182168a2f7b0aa32
サイバー攻撃に防衛隊を組織教育
https://qiita.com/kaizen_nagoya/items/5bc6235c509e4fb108f0
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＜この記事は個人の過去の経験に基づく個人の感想です。現在所属する組織、業務とは関係がありません。＞
This article is an individual impression based on my individual experience. It has nothing to do with the organization or business to which I currently belong.
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