Epoxy Chip Underfill adhesive

@underfilladhesive1

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DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity,

Site/Bloghttps://www.deepmaterialcn.com/epoxy-based-chip-underfill.html

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Huizhou City, Guangdong，China

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