はじめに

本記事では、英語の勉強に役立つ半導体の前工程と後工程について解説します。英語の技術用語を学びながら、実践的な語学力を向上させることができます。

Semiconductor Manufacturing Process

Semiconductors are key components in devices like computers and smartphones. Making semiconductors involves many steps. Let's break down the process in an easy-to-understand way.

Front-End Process

Circuit and Pattern Design
First, we design the circuit to decide how the semiconductor will function. Then, we create a "pattern" of this circuit, which is transferred onto a wafer (the base material for semiconductors).

Creating the Photomask
To transfer the circuit pattern onto the wafer, we create a "photomask." This mask works like a stencil, helping the circuit pattern to be projected onto the wafer, much like a shadow.

Pulling the Ingot
Silicon, the main material used in semiconductors, is melted and pulled into a rod shape called an "ingot."

Cutting the Ingot
The ingot is sliced into thin wafers. These wafers will serve as the base for creating semiconductors.

Polishing the Wafer
The wafer's surface is polished to make it smooth. This ensures that the next steps will be clean and precise.

Wafer Oxidation
A protective layer of oxide is formed on the wafer’s surface. This helps make the following steps smoother and easier.

Coating the Wafer with Photoresist
A special light-sensitive liquid called "photoresist" is applied to the wafer. This liquid helps transfer the circuit pattern onto the wafer.

Transferring the Pattern
Using the photomask, the circuit pattern is transferred to the wafer. This step creates the actual shape of the circuit on the wafer.

Etching
Unwanted parts of the wafer are removed by etching, based on the pattern, to form the final circuit shape.

Chemical Mechanical Planarization (CMP)
The wafer's surface is flattened using CMP. This ensures the wafer is perfectly smooth.

Forming Electrodes
Metal electrodes are added to the wafer to allow for electrical connections. This completes the circuit on the wafer.

Back-End Process

Wafer Dicing
The completed wafer is sliced into small individual chips, a process called "dicing."

Mounting the Chips
The chips are placed onto a protective base called a "substrate" to keep them secure.

Wire Bonding
Wires are used to connect the chip to the substrate, creating a path for electricity to flow.

Trimming and Forming (Cutting and Shaping)
The chip is trimmed into the required shape for packaging.

Burn-In Testing (Temperature and Voltage Testing)
The chip is tested under high temperature and voltage to ensure it works properly. This ensures its quality.

Molding
The chip is placed in a protective mold to shield it from damage or contamination.

Marking
Information, like the product type and model number, is marked on the chip. This helps identify the chip.

Semiconductor Completion
Finally, after all the steps are finished, the semiconductor chip is complete and ready for use in devices like computers and smartphones.

This process involves multiple detailed steps, but it ultimately results in the semiconductor chips that power many of the devices we use every day.

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